Helios

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Out of stock

The Helios board is a Class 3 rhomb.io Carrier Board that integrates the rhomb.io modular ecosystem in a development board. Helios is immediately useful, you only need a rhomb.io Master module plugged on the board to start to develop your projects quickly and easily. Is not a simple development board, it is the most upgradable device you will find on the market. It gives the opportunity to easily assemble your machine according not only to your needs, but to your imagination.

Out of stock

The Helios board is a Class 3 rhomb.io Carrier Board that integrates the rhomb.io modular ecosystem in a development board. Helios is immediately useful, you only need a rhomb.io Master module plugged on the board to start to develop your projects quickly and easily. Is not a simple development board, it is the most upgradable device you will find on the market. It gives the opportunity to easily assemble your machine according not only to your needs, but to your imagination.

The most common interfaces such USB, UART, I2C, SPI, digital inputs/outputs are available on the board. But there are no limits on the Helios capabilities: LoRa, ZigBee, movement sensing, GPS…, all those are available on standard rhomb.io Slave modules. The only thing you need is to connect them on the corresponding sockets. Furthermore, several microcontrollers of differets manufacturers are compatible thanks to rhomb.io modular technology. If there is a need for more processing power, you don’t need to replace the Helios, the only thing you have to do is replace the Master module for another more powerful. Helios Carrier Board is fully compatible with Arduino and all its shields with extra features.

Applications:

  • Prototyping tool
  • Industrial automation
  • Home automation
  • Internet Of Things
  • Energy efficiency
  • Monitoring
  • Data acquisition
  • Technology for artists

Specifications

rhomb.io Sockets1x rhomb.io S300 Master Socket
1x rhomb.io Slave Sockets
Memory64-bit Unique-ID Memory with 112 B User EEPROM
Micro SD holder
Connections36 signals brought to 4 sockets Arduino shield compatible
98 signals brought to 2.54 mm headers
100 signals brought to FPC connectors
ICSP and JTAG connectors
ButtonssUser and Reset buttons
Power2x USB
1 DC/DC converter: 5V@1.5A
3 LDOs: 3.3V@600mA, 2.8V@300mA, 1.8V@300mA
BatteryBattery Connector
Battery charger with potentiometer: 15 to 500 mA
Dimensions:83.7 x 70 mm
Op. Voltage1.8 V to 28 V
Op. Temperature-25 ºC to +85 ºC

Documentation

3D VIEW

Class 3 - Helios Top.png           Class 3 - Helios Bottom.png

BOARD SPECIFICATIONS

Helios Carrier Board has been designed for working only with standard rhomb.io Master modules. When you connect one to the board, you have direct access to all its signals. Thanks to the 134 pin headers, the board offers a huge amount of communications interfaces such as I2C, SPI, UART or USB. The arrangement of these headers follows the Arduino standard, so you can plug any compatible Arduino shield. In addition, two FPC connectors bring out the S300 signals from those more powerful Master modules. To all this we must add a rhomb.io Slave socket to bring a countless amount of customization options.

Unlike other rhomb.io Carrier Boards, the Slave socket does not follow the rhomb.io Starndard connection. In the Helios, Arduino pin headers are considered as the main Slave socket, so the signals from the Master that should be connected to the Slave 1 socket are tied to the Arduino pin headers. The official Slave rhomb.io socket acts like Slave 2.

There are available a JTAG connector and a ICSP connector to for programming and debugging the rhomb.io Master module plugged on the board.

There are three different ways to empower the Helios: using the micro-USB connectors, using a battery or using the DC power input. The system will automatically detect the power supply used and it will turn on. The board also includes a lithium battery charge management controller bringing the capacity to work independently of the power supply. Three low-dropout regulators (LDO) provide the board with all necessary voltages for the operation of any Rhomb.io plugged on any socket.

User and reset buttons, user LED, ID memory and micro-SD holder are available on the Helios board.

The next figure shows the block diagram for the Helios:

Class 3 - Helios Block Diagram.png

The following figure identify the main parts of the board.

Class 3 - Helios Description Top.png
Class 3 - Helios Description Bottom.png

CONNECTIVITY

WIRED

There are available 2 USB 2.0 ports on the Helios. One of them (J5) works as a host and can be used to flash the microcontroller code of the Master module. The other one (J4) works as On-The-Go, and it is connected to the OTG lines from Master module and to the Slave module socket. The USB ports also are tied to the pin headers. These ports can be used as a supply source too. See the “Power” section for more datails.

There are also JTAG and ICSP connectors for programming and debugging the rhomb.io Master module plugged on the board. The following tables shows the pinout of the these connectors.

JTAG ICSP
Pin Function Pin Function Pin Function Pin Function
1 VIO_OUT 2 TMS/SWDIO 1 SPI-A_MISO 2 VIO_OUT
3 GND 4 TCK/SWCLK 3 SPI-A_SCK 4 SPI-A_MOSI
5 GND 6 TDO/SWO 5 #RESET_IN 6 GND
7 TRST 8 TDI
9 GND 9 #RESET_IN

It is also eight pin headers with a total of 134 pins. Four of these headers have the Arduino standar arrangement, so you can use in the Helios board all shields compatible with Arduino and they will work as if it were the Slave 1 module of the rhomb.io Standard. The other four pin headers allow to access to all S200 rhomb.io Master module signals. The following table shows the pinout.

H1 H3
Pin Function Pin Function
1 USB_P 1 I2C-A_SCL
2 USB_N 2 I2C-A_SDA
3 3 AREF0
4 4 GND
5 5 SPI-A_SCK
6 VIO_OUT 6 SPI-A_MISO
7 #RESET_IN 7 SPI-A_MOSI
8 3V3 8 SPI-A_CS0
9 VSYS 9 PWM0
10 GND 10 IO4
11 GND
12 VIN
H2 H4
Pin Function Pin Function
1 AD0 1 IO3
2 AD1 2 IO2
3 AD2 3 IO1
4 AD3 4 IO0
5 AD4 5 INT0
6 AD5 6 #NMI0
7 UART-A_TXD
8 UART-A_RXD
H5 H6
Pin Function Pin Function Pin Function Pin Function
1 TS_XR 2 IO28 1 IO8 2 DIFF-A_N
3 TS_YD 4 IO27 3 IO9 4 DIFF-A_P
5 TS_XL 6 IO26 5 IO10 6 AD13
7 TS_YU 8 SPI-A_CS2 7 IO11 8 COMP-B_N
9 GND 10 SPI-A_CS1 9 IO12 10 COMP-B_P
11 CAN-B_RXD 12 SPI-B_CS0 11 IO13 12 AREF1
13 CAN-B_TXD 14 SPI-B_SCK 13 IO14 14 GND
15 OTG_P 16 SPI-B_MISO 15 IO15 16 1V8
17 OTG_N 18 SPI-B_MOSI 17 IO16 18 2V8
19 OTG_ID 20 I2C-B_SCL 19 IO17 20 3V3
21 QSPI_CS1 22 I2C-B_SDA 21 IO18 22 VIN_REG
23 QSPI_CS2 24 UART-D_TXD 23 IO19 24 VSYS
25 RS485_TXEN 26 UART-D_RXD 25 IO20 26 CAPT1
27 PWM1 28 UART-C_TXD 27 IO21 28 CAPT0
29 PWM2 30 UART-C_RXD 29 IO22 30 INT6
31 PWM3 32 31 IO23 32 INT5
33 PWM4 34 COMP-A_N 33 DAC0 34 INT4
35 CAN-A_TXD 36 COMP-A_P 35 DAC1 36 INT3
37 CAN-A_RXD 38 AD6 37 1WIRE 38 INT2
39 GND 40 VBAT 39 GND 40 INT1
H7 H8
Pin Function Pin Function
1 QSPI_CS0 1 RESET_OUT
2 QSPI_IO3 2 UART-B_TXD
3 QSPI_IO2 3 UART-B_RXD
4 QSPI_CLK 4 VRTC
5 QSPI_IO1 5
6 QSPI_IO0 6 CLK32K
7 #NMI_SLAVE 7 UART-A_CTSN
8 UART-A_RTSN
9 IO7
10 IO6
11 IO5

For the S300 signal there are two 50-pin FPC connectors with the following pinout:

J1 J2
Pin Function Pin Function
1 RMII_MDC 1 CAM_HSYNC
2 RMII_MDIO 2 CAM_VSYNC
3 RMII_TXD1 3 CAM_PIXCLK
4 RMII_TXD0 4 CAM_PIXCLK_OUT
5 RMII_RX_CLK 5 CAM_D7
6 RMII_RXD0 6 CAM_D6
7 RMII_RXD1 7 CAM_D5
8 RMII_TX_EN 8 CAM_D4
9 RMII_RX_DV 9 CAM_D3
10 RMII_RX_ER 10 CAM_D2
11 GND 11 CAM_D1
12 12 CAM_D0
13 13 GND
14 14 LCD_BKL0
15 15 LCD_ON
16 16 LCD_HCK
17 17 LCD_HSYNC/HST/8bE
18 18 LCD_CLK/VCK
19 19 LCD_VSYNC/VST/8bRS
20 20 LCD_XFRP
21 21 LCD_RST
22 22 LCD_DEM/8bRW
23 23 LCD_EXTCLK
24 24 VD_IO0/LCD_BKL1
25 GND 25 GND
26 26 LCD_R7
27 27 LCD_R6
28 28 LCD_R5
29 29 LCD_R4
30 30 LCD_R3
31 31 LCD_R2
32 32 LCD_R1
33 33 LCD_R0
34 34 LCD_G7
35 35 LCD_G6
36 36 LCD_G5
37 GND 37 LCD_G4
38 I2S_CDCLK 38 LCD_G3
39 I2S_LRCK 39 LCD_G2
40 I2S_SCLK 40 LCD_G1
41 I2S_SDO 41 LCD_G0
42 I2S_SDI 42 LCD_B7
43 GND 43 LCD_B6
44 CAM_D13 44 LCD_B5
45 CAM_D12 45 LCD_B4
46 CAM_D11 46 LCD_B3
47 CAM_D10 47 LCD_B2
48 CAM_D9 48 LCD_B1
49 CAM_D8 49 LCD_B0
50 GND 50 GND
Class 3 - Helios Wired.png

WIRELESS

Helios board has no integrated wireless interfaces, but you can use communication rhomb.io modules.

MEMORY

Two memory options are available for the Helios: a micro-SD card and storage rhomb.io modules.

VIDEO/AUDIO

The 50-pin FPC connnectors of Helios has a CAM port and 71 LCD lines. In adition, you can use video/audio Rhomb.io modules.

LEDs and BUTTONS

4 LEDs are assembled on the Helios in order to give status feedback to the user. The functionality is explained next:

  • Battery status LED: Formed by two LED, one yellow and one green. The yellow one turns on when the battery is being charging and turns off when the battery is fully charged. The green one turns on when the battery is fully charged.
  • Red LED: Turned on when the power supply (from DC connector or USB connectors) is ready.
  • User LED: Programmable LED controlled by the PWM0 signal of the Master module.

The Reset button is used to reset the microcontroller of the Master module. The capacitor of the reset button can interfere in some aplications, but you can disconnect it by open solder-jumper located in the bottom side of the board. Notice that solder-jumper is bypassed by default, so you must cut the indicated track the first time.

The User button is connected to the #NMI signals of the modules and can be programmed as you want.

Class 3 - Helios LED&Buttons.png

RHOMB.IO CONNECTIONS

The following table summarizes the standard signals of the rhomb.io Master module socket and where they are used in the Helios board. These signals may have no functionality depending of the microcontroller plugged on the board.

J301 Connector
Pin Rhomb.io Signal Used by Pin Rhomb.io Signal Used by
1 GND GND 50 GND GND
2 SDIO_CMD Slave Socket
SD Card
49 QSPI_CS0 H7.1
3 SDIO_CDN 48 QSPI_IO3 Slave Socket
H7.2
4 SDIO_DATA3 47 QSPI_IO2 Slave Socket
H7.3
5 SDIO_DATA2 46 QSPI_CLK Slave Socket
H7.4
6 SDIO_CLK 45 QSPI_IO1 Slave Socket
H7.5
7 SDIO_DATA1 44 QSPI_IO0 Slave Socket
H7.6
8 SDIO_DATA0 43 GND GND
9 GND GND 42 USB_N J5 USB Connector
H1.2
10 EXT0 41 USB_P J5 USB Connector
H1.1
11 EXT1 40 GND GND
12 EXT2 39 UART-B_RXD Slave Socket
H8.3
13 EXT3 38 UART-B_TXD Slave Socket
H8.2
14 EXT4 37 GND GND
15 EXT5 36 I2C-A_SDA Slave Socket
H3.2
16 EXT6 35 I2C-A_SCL Slave Socket
H3.1
17 GND GND 34 #NMI0 User button
H4.6
18 VRTC Slave Socket
H8.4
33 GND GND
19 CLK32K Slave Socket
H8.6
32 SPI-A_MISO Slave Socket
ICSP Connector, H3.6
20 GND GND 31 SPI-A_MOSI Slave Socket
ICSP Connector, H3.7
21 CAN-A_RXD Slave Socket
H5.37
30 SPI-A_CLK Slave Socket
ICSP Connector, H3.5
22 CAN-A_TXD Slave Socket
H5.35
29 SPI-A_CS0 H3.8
23 VBAT VBAT
Battery Connector
Battery Charger
H5.40
28 INT0 H4.5
24 27 GND GND
25 26 RESET_OUT Slave Socket
H8.1
J302 Connector
Pin Signal Used by Pin Signal Used by
1 GND GND 50 GND GND
2 DIFF-A_N H6.2 59 DIFF-A_P H6.4
3 IO0 H4.4 48 1WIRE Slave Socket
ID EEPROM
H6.37
4 IO1 H4.3 47 VIO_OUT VIO_OUT
H1 pin 6
5 IO2 H4.2 46 VIO_IN_MASTER
6 IO3 H4.1 45 GND GND
7 IO4 H3.10 44 1V8 1V8
H6.16
8 IO5 H8.11 43 GND GND
9 IO6 H8.10 42 SAI-A_BCLK
10 IO7 H8.9 41 SAI-A_LRCLK
11 SAI-A_MCLK 40 SAI-A-SDI
12 GND GND 39 SAI-A_SDO
13 UART-A_RTSN H8.8 38 GND GND
14 UART-A_RXD H4.8 37
15 UART-A_TXD H4.7 36 2V8 2V8
H6.18
16 UART-A_CTSN H8.7 35
17 GND GND 34 GND GND
18 AD0 H2.1 33
19 GND GND 32 3V3 3V3
H1.8
H6.20
20 PWM0 User LED
H3.9
31
21 CAPT0 Slave Socket
H6.28
30 GND GND
22 CAPT1 Slave Socket
H6.26
29
23 VSYS VSYS
H1.9
H6.24
28 VIN_REG VIN_REG
H6.22
24 27
25 26 #RESET_IN Reset Button
ICSP Connector
JTAG/SWD Connector
H1.7
J303 Connector
Pin Signal Used by Pin Signal Used by
1 TS_XR H5.1 50 AD5 H2.6
2 TS_YD H5.3 49 AD6 H5.38
3 TS_XL H5.5 48 COMP-A_P H5.36
4 TS_YU H5.7 47 COMP-A_N H5.34
5 GND GND 46 GND GND
6 JTAG_TRST JTAG/SWD Connector 45 UART-C_RXD Slave Socket
H5.30
7 CAN-B_RXD H5.11 44 UART-C_TXD Slave Module
H5.28
8 CAN-B_TXD H5.13 43 UART-D_RXD H5.26
9 PWM4 H5.33 42 UART-D_TXD H5.24
10 OTG_P Slave Socket
J4 USB Connector
H5.15
41 I2C-B_SDA H5.22
11 OTG_N Slave Socket
J4 USB Connector
H5.17
40 I2C-B_SCL H5.20
12 OTG_ID J4 USB Connector
H5.19
39 SPI-B_MOSI H5.18
13 QSPI_CS1 Slave Socket
H5.21
38 SPI-B_MISO H5.16
14 QSPI_CS2 H5.23 37 SPI-B_CLK H5.14
15 SAI-B_SDO 36 SPI-B_CS0 H5.12
16 SAI-B_SDI – 35
17 SAI-B_LRCLK – 34 GND GND
18 SAI-BCLK – 33 SPI-A_CS1 Slave Socket
H5.10
19 SAI-MCLK – 32 SPI-A_CS2 H5.8
20 31 IO26 H5.6
21 30 IO27 H5.4
22 29 IO28 H5.2
23 28 PWM3 H5.31
24 27 PWM2 H5.29
25 H5.25 26 PWM1 H5.27
J304 Connector
Pin Signal Used by Pin Signal Used by
1 50 IO8 Slave Socket
H6.1
2 59 IO9 Slave Socket
H6.3
3 INT6 H6.30 48 IO10 Slave Socket
H6.5
4 INT5 H6.32 47 IO11 Slave Socket
H6.7
5 INT4 H6.34 46 IO12 Slave Socket
H6.9
6 INT3 H6.36 45 IO13 Slave Socket
H6.11
7 INT2 H6.38 44 IO14 Slave Socket
H6.13
8 INT1 Slave Socket
H6.40
43 IO15 Slave Socket
H6.15
9 GND GND 42 GND GND
10 JTAG_TMS/SWDIO JTAG/SWD Connector 41 IO16 H6.17
11 JTAG_TCK/SWCLK 40 IO17 H6.19
12 JTAG_TDO/SWO 39 IO18 H6.21
13 JTAG_TDI 38 IO19 H6.23
14 1V8 1V8
H6.16
37 IO20 H6.25
15 2V8 2V8
H6.18
36 IO21 H6.27
16 35 IO22 H6.29
17 3V3 3V3
H1.8
H6.20
34 IO23 H6.31
18 33 DAC0 H6.33
19 32 DAC1 H6.35
20 AREF1 H6.12 31
21 AREF0 H3.3 30 GND GND
22 GND GND 29 AD1 Slave Socket
H2.2
23 COMP-B_P H6.10 28 AD2 H2.3
24 COMP-B_N H6.8 27 AD3 H2.4
25 AD13 H6.6 26 AD4 H2.5
J305 Connector
Pin Signal Used by Pin Signal Used by
1 RMII_MDC J1 FPC Connector 50 GND GND
2 RMII_MDIO 49 CAM_D8 J1 FPC Connector
3 RMII_TXD1 48 CAM_D9
4 RMII_TXD0 47 CAM_D10
5 RMII_RX_CLK 46 CAM_D11
6 RMII_RXD0 45 CAM_D12
7 RMII_RXD1 44 CAM_D13
8 RMII_TX_EN 43 GND GND
9 RMII_RX_DV 42
10 RMII_RX_ER 41
11 GND GND 40
12 39
13 38
14 37 GND GND
15 36
16 35
17 34
18 33
19 32
20 31
21 30
22 29
23 28
24 27
25 GND GND 26
J306 Connector
Pin Signal Used by Pin Signal Used by
1 LCD_R7 J2 FPC Connector 50 GND GND
2 LCD_R6 59 LCD_BKL1/VD_IO0 J2 FPC Connector
3 LCD_R5 48 LCD_EXTCLK
4 LCD_R4 47 LCD_DEN/8bRW
5 LCD_R3 46 LCD_RST
6 LCD_R2 45 LCD_XFRP
7 LCD_R1 44 LCD_VSYNC/VST/8bRS
8 LCD_R0 43 LCD_CLK/VCK
9 LCD_G7 42 LCD_HSYNC/HST/8bE
10 LCD_G6 41 LCD_HCK
11 LCD_G5 40 LCD_ON
12 LCD_G4 39 LCD_BKL0
13 LCD_G3 38 GND GND
14 LCD_G2 37 CAM_D0 J2 FPC connector
15 LCD_G1 36 CAM_D1
16 LCD_G0 35 CAM_D2
17 LCD_B7 34 CAM_D3
18 LCD_B6 33 CAM_D4
19 LCD_B5 32 CAM_D5
20 LCD_B4 31 CAM_D6
21 LCD_B3 30 CAM_D7
22 LCD_B2 29 CAM_PIXCLK_OUT
23 LCD_B1 28 CAM_PIXCLK
24 LCD_B0 27 CAM_VSYNC
25 GND GND 26 CAM_HSYNC

Notes:

  • Functions with “HX.YY” estructure indicate designator HX and pin number YY.
  • “I2C-A” signals are pulled-up to VIO from the Master through 4K7 resistors. Those pull-ups are defined as normally connected to the supply. If you want to disconnect the supply, there is a solder-jumper next to the pull-up resistors (SJ4).
  • In order to avoid the malfunction of the OTG USB bus when it multiplexed, the tracks tied to the Slave socket are open. If you required to use the USB interface with the Slave module, you can close the solder-jumper located on the bottom side of the board.

POWER

Helios can be powered in three differents ways: by connecting a USB cable, by connecting a battery or by using the DC barrel connector. The system will automatically detect the power supply used and it will turn on. The board provides the needed voltages for the rhomb.io sockets. For doing so, Low-Dropout Regulators (LDO) has been included for supplying the 1.8, 2.8 and 3.3 voltages with 300 mA, 300 mA and 600 mA respectively. The “VSYS” voltage is switched in between 5V from DC connector, 5V from USB connectors and VBAT (battery voltage) according to the following cases:

  • There is battery and the USB or DC supply are not connected: VSYS = VBAT
  • There is battery and the USB or DC supply are connected: VSYS = 5V
  • There is no battery and the USB or DC supply is connected: VSYS = 5V
  • There is no battery and the USB or DC supply is not connected: VSYS = 0V

As per the above, the Helios board can work connected to a USB, connected to a 5V DC source or with a battery. A lithium battery charge management controller bringing the capacity to work independently of the power supply. Only single cell Li-Po or Li-Ion batteries are supported. The charging current ranges from 15 to 500 mA. You can adjust it with potentiometer P1 following the next formula:

Ichrg (mA) = 1000V/(2k+P1) ohm

The “on/off” header allows you to turn off the system by open the jumper while the battery is still charging.

The input voltage range for the DC supply is 3V to 40V.

MECHANICAL SPECIFICATIONS

Class 3 - Helios Dimensions.png

WARRANTY

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
    1. The users should wear anti-static clothing and use earth band when manipulating the device.
    2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
    3. Equipment and work table must be earthed.
    4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

DISCLAIMER

rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

All brand names, trademarks and registered trademarks belong to their respective owners.

We are constantly striving to improve the quality of our technical notes. If you find an error or omission please let us know.

Email us at: info@rhomb.io

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