Documentation

Core specifications

The S400 – Renesas RZ/A1H – RZ/A1M assembles a single-chip SoC which includes an ARM Cortex A9 processor with 32-KByte L1 instruction cache, a 32-Kbyte L1 data cache, and a 128-Kbyte L2 cache. This SoC also includes on-chip peripheral functions necessary for system configuration, such as 10-MByte (RZ/A1H) or 5-MByte (RZ/A1M) large-capacity RAM (128 Kbytes are shared by the data-retention RAM), data-retention RAM, 2D graphics accelerator based on OpenVG, and a wide amount of port interconnections.

For the user program, the board embeds two Flash memories available in 16MB and 32MB. The system booting can be done through one of those onboard Flash memories or through external memories connected to the eMMC or SD interfaces available on the standard Rhomb.io Connectors.

Enabled for support with Linux, RTOS or bare-metal, this Rhomb.io Core module is the ideal device for designing modular and intelligent IoT and Human Interface (HMI) devices with compactness and high performance. It also manages the power supply for complete modular systems and is easily pluggable on the standard Rhomb.io Core Sockets. Look at the following table to see the complete capabilities according to the Rhomb.io Standard.

Rhomb.io available interfaces
Video	HDMI	No	USB	HSIC	No	SATA	SATA-A	No	Ethernet	RGMII	No
	LVDS	Yes		OTG	Yes		SATA-B	No		RMII	No
	RGB	No		USB-A	Yes	PCIE	PCIE-A	No		MII	Yes
MIPI	DSI	No		USB-B	Yes		PCIE-B	No	Clocks	CLK32K_0	Yes
	CSI	No		USB-C	Yes	1WIRE	BUS	Yes		CLK32K_1	Yes
SDIO	SDIO-A	Yes	UART	UART-A	Yes		uOMIC	Yes	CAN	CAN-A	Yes
	SDIO-B	Yes		UART-B	Yes	QSPI	Yes			CAN-B	Yes
	SDIO-C	Yes		UART-C	Yes	I2S	Yes		GPIO	18
	SDIO-D	No		UART-D	Yes	A/D	2
SPI	SPI-A	Yes	I2C	I2C-A	Yes	PWM	4		XINT	6
	SPI-B	Yes		I2C-B	Yes

The power solution for this Core is provided by the Tecnofingers uOMIC, an integrated Power Managemet Integrated Circuit (PMIC) that contains 9 high efficient buck converters, 26 LDOs, RTC, 3-channel 32kHz clock output, backup battery charger, manual reset and shutdown inputs, reset output, input and output interrupts and UART serial interface to program individual regulator output voltages and on/off control. All this for having a complete and eficient power management of the entyre modular system.

The Renesas RZ/A1H – RZ/A1M core also integrates a 1-Wire factory-programmed ROM (with a unique 64-bit ID number) and a crypto-authentication device that ensures that the core and the firmware it runs are not cloned, counterfeited, or tampered with.

The following image shows the Block Diagram.

Flash Memories

As it has been indicated above, the Renesas RZ/A1H – RZ/A1M core module assembles two Flash memories with two capacity available: 2x16MB or 2x32MB. Those two flash memories are controlled trough QSPI and all the signals are available on the connectors Aux1 and Aux2 for programming them. The following diagram specifies the flash memories interconnections with the SoC.

It is possible to use the Flash Memory 1 for system booting. Look at the Bootloader section for more details.

UART Switch

The Renesas RZ/A1H – RZ/A1H Rhomb.io Core Module includes a 1×2 double pole analog switch for allowing UART communication in between the SoC and the Tecnofingers uOMIC PMIC. The same UART port can be switched to connect with the UART-D port on the Rhomb.io Standard Connectors (J401).

The switching can be done by driving high or low the pin P6_15 on the SoC according to the following table.

P6_15 status	Description
‘0’	Default status. The SoC UART port connects to the Rhomb UART-D port
‘1’	The SoC UART port connects to the PMIC

On the default status (low level), the SoC UART port connects with the Rhomb.io UART port D (UART-D, connector J401). When the pin P6_15 is at high level, the SoC UART port connects to the PMIC UART port for power management. In this mode, any change in the PMIC default configuration may cause system failures or even irreversible damage.

Step Up

There is a low noise and low ripple 5V-output Step-Up IC for the USB2.0. This switched power supply can provide a maximum of 240 mA to the OTG VBUS. Take care to not connect any device on the VBUS line that may overcome this value.

Bootloader

The Renesas RZ/A1H – RZ/A1M offers three modes for booting the system: through the onboard Flash memory 1 or through external memories connected to the eMMC or SD interfaces available on the standard Rhomb.io Connectors. For doing so, the signals BOOT_SW0 to BOOT_SW5 should be configured as indicated on the next table. Those signals are available on the J408 connector.

Booting configuration
BOOT_						Mode	Description
SW0	SW1	SW2	SW3	SW4	SW5
1	1	X	0	X	0	SPI	Flash memory 1 booting
1	1	X	1	X	0	eMMC	SDIO-A Rhomb.io channel
1	0	X	1	X	0	SD	SDIO-C Rhomb.io channel

Auxiliar connectors

The Auxiliar connector 1 and Auxiliar connector 2 give access to the Flash Memory 1 and the Flash Memory 2 in order to program them.

The Auxiliar connector 2 also allows to program the Tecnofingers uOMIC power management circuit (PMIC). This feature is only for firmware updating and any change on it may cause serious damage on the Renesas RZ/A1H – RZ/A1M Rhomb.io Core and the entire system where it is connected. Only for Rhomb.io usage.

The next table identifies the signals connected to the Auxiliar connector 1 and the Auxiliar connector 2.

Auxiliar connectors pinout
Connector 1				Connector 2
Pin	Signal	Pin	Signal	Pin	Signal	Pin	Signal
1	Memories Vcc	6	Mem. 1 Data2	1	Memories Vcc	6	Mem. 2 Data2
2	Mem. CLK	7	Mem. 1 Data3	2	Mem. CLK	7	Mem. 2 Data3
3	Mem. #CS	8	Unused	3	Mem. #CS	8	SWDIO_DATA
4	Mem. 1 Data0	9	Memories #RST	4	Mem. 2 Data0	9	SWDIO_CLK
5	Mem. 1 Data1	10	VSYS	5	Mem. 2 Data1	10	PMIC #RST

Connectors

The following table indicates the pinout of each one of the eight Rhomb.io Standard connectors. It has been grouped the signals according to its functionality and according to the Rhomb.io Standard. Each pin on the connector supports a maximum of 300 mA.

J401 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	GND		GND	26	GND		GND
2	CAN-A_TXD	P7_9	CAN interface	27	UART-C_RTSN	P7_7	UART-B interface
3	CAN-A_RXD	P7_8		28	SPI-B_CSN	P8_4	SPI-B interface
4	I2S_SCLK	P4_4	I2S interface	29	UART-A_TXD	P6_6	UART-A interface
5	CAN-B_TXD	P5_10	CAN interface	30	PWM_OUT0	P3_2	PWM 0 output
6	CAN-B_RXD	P1_4		31	SPI-A_CLK	P2_12	SPI-A interface
7	I2S_LRCK	P4_5	I2S interface	32	PWM_OUT1	P3_0	PWM output 1
8	I2S_CDCLK	NOT AVAILABLE		33	UART-D_RXD	P6_2*	UART-D interface
9	I2S_SDO	P2_11		34	I2C-B_SCL	P1_2	I2C-B interface
10	I2S_SDI	P4_6		35	GND		GND
11	I2C-A_SCL	P1_0	I2C-A interface	36
12	UART-B_RXD	P6_13	UART-B interface	37
13	SPI-B_CLK	P8_3	SPI-B interface	38	UART-A_RTSN	NOT AVAILABLE	UART-A interface
14	GND		GND	39	SPI-B_MISO	P8_6	SPI-B interface
15				40	SPI-A_MISO	P2_15	SPI-A interface
16				41	UART-C_CTSN	P7_6	UART-C interface
17	PWM_OUT2	P4_7	PWM 2 output	42	I2C-A_SDA	P1_1	I2C-A interface
18	PWM_OUT3	P3_3	PWM 3 output	43	UART-B_CTSN	NOT AVAILABLE	UART-B interface
19	SPI-A_MOSI	P2_14	SPI-A interface	44	UART-A_CTSN	NOT AVAILABLE	UART-A interface
20	UART-C_RXD	P7_5	UART-C interface	45	UART-D_TXD	P3_1*	UART-D interface
21	SPI-B_MOSI	P8_5	SPI-B interface	46	UART-A_RXD	P6_7	UART-A interface
22	UART-B_TXD	P6_12	UART-B interface	47	UART-B_RTSN	NOT AVAILABLE	UART-B interface
23	I2C-B_SDA	P1_3	I2C-B interface	48	UART-C_TXD	P7_4	UART-C interface
24	SPI-A_CSN	P2_13	SPI-A interface	49	RFU	NOT AVAILABLE	Reserved
25	GND		GND	50	GND		GND
J402 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	GND		GND	26	GND		GND
2				27	VIDEO_VD15	NOT AVAILABLE	RGB video output
3	VIDEO_VD16	NOT AVAILABLE	RGB video output	28	VIDEO_VD00
4	VIDEO_VD22			29	VIDEO_CLK
5	VIDEO_VD13			30	VIDEO_VD18
6	VIDEO_VD01			31	VIDEO_SYS_OE
7	VIDEO_VD04			32	VIDEO_VD11
8	VIDEO_VD09			33	VIDEO_VSYNC
9	VIDEO_VSYNC_LDI			34	VIDEO_VD06
10	VIDEO_VD23			35	VIDEO_HSYNC
11	VIDEO_VD14			36	VIDEO_VD12
12	GND		GND	37	VIDEO_VD03
13				38	VIDEO_VD17
14	VIDEO_VD05	NOT AVAILABLE	RGB video output	39	SWDIO_CLK	uOMIC SWDCLK	SWD interface
15	VIDEO_VD10			40	SWDIO_DATA	uOMIC SWDDIO
16	VIDEO_EN			41	GND		GND
17	VIDEO_VD20			42	HDMI_D2_P	NOT AVAILABLE	HDMI interface
18	VIDEO_VD07			43	HDMI_D2_N
19	VIDEO_VD08			44	HDMI_D1_P
20	VIDEO_VD02			45	HDMI_D1_N
21	VIDEO_VD21			46	HDMI_D0_P
22	VIDEO_VD19			47	HDMI_D0_N
23	LDO-A_2V8	uOMIC OUT04	uOMIC OUT04 LDO	48	HDMI_CLK_P
24	LDO-B	uOMIC OUT05	uOMIC OUT05 LDO	49	HDMI_CLK_N
25	GND		GND	50	GND		GND
J403 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	RXER	P3_5	Ethernet interface	26	GND		GND
2	GND		GND	27	GPIO01	NOT AVAILABLE	GPIOs
3	HSIC_DATA	NOT AVAILABLE	HSIC interface	28	GPIO02
4	HSIC_STROBE			29	GND		GND
5	GND		GND	30
6	XEINT15	NOT AVAILABLE	Interruptions	31	GPIO03	P1_11	GPIOs
7	XEINT14			32	GPIO00	P1_10
8	XEINT13	P6_1		33	HSIC_OC	NOT AVAILABLE	HSIC interface
9	XEINT12	NOT AVAILABLE		34	JTAG_TMS	TMS/SWDIO	JTAG interface
10	XEINT11			35	GPIO04	P0_5	GPIOs
11	XEINT10			36	GPIO05	NOT AVAILABLE
12	XEINT09			37	JTAG_TRSTN	#TRST	JTAG interface
13	XEINT08			38	HSIC_PWREN	NOT AVAILABLE	HSIC interface
14	XEINT07	P6_8		39	JTAG_TDI	JP0_0	JTAG interface
15	XEINT06	NOT AVAILABLE		40	JTAG_CLK	TCK/SWDCLK
16	XEINT05			41	JTAG_TDO	JP0_1
17	XEINT04			42	GND		GND
18	XEINT03	P6_9		43	USB_OTG_P	DP1	USB OTG interface
19	XEINT02	P6_10		44	USB_OTG_N	DM1
20	XEINT01	P6_11		45	GND		GND
21	RST_OUT	NOT AVAILABLE	Reset output	46	USB_OTG_DRVBUS	NOT AVAILABLE	USB OTG interface
22	XEINT00	P1_15	Interruptions	47	JTAG_NRST	#RST_SoC	JTAG interface
23	RST_CPU	NOT AVAILABLE	CPU reset	48	USB_OTG_VBUS	USB_OTG_VBUS	USB OTGinterface
24	GND		GND	49	USB_OTG_ID	NOT AVAILABLE
25				50	TXER	P2_1	Ethernet interface
J404 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	GND		GND	26	GND		GND
2	GPIO06	NOT AVAILABLE	GPIOs	27	QSPI_CS1	NOT AVAILABLE	QSPI interface
3	GND		GND	28	MIPI_DSI_D0_N	NOT AVAILABLE	MIPI display interface
4	LDO-C	uOMIC OUT17	OUT17	29	MIPI_DSI_D0_P
5	GND		GND	30	MIPI_DSI_D1_N
6	AD_IN3	P1_12	ADC inputs	31	MIPI_DSI_D1_P
7	AD_IN0	P1_13		32	MIPI_DSI_CLK_N
8	AD_IN2	NOT AVAILABLE		33	MIPI_DSI_CLK_P
9	AD_IN1			34	MIPI_DSI_D2_N
10	GND		GND	35	MIPI_DSI_D2_P
11	RFU	NOT AVAILABLE	Reserved	36	MIPI_DSI_D3_N
12				37	MIPI_DSI_D3_P
13				38	GND		GND
14	LVDS_TX0_P	P5_6	LVDS interface	39	MIPI_CSI-A_D0_N	NOT AVAILABLE	MIPI camera interface A
15	LVDS_TX0_N	P5_7		40	MIPI_CSI-A_D0_P
16	LVDS_TX1_N	P5_5		41	MIPI_CSI-A_D1_N
17	LVDS_TX1_P	P5_4		42	MIPI_CSI-A_D1_P
18	LVDS_TX2_N	P5_3		43	MIPI_CSI-A_CLK_N
19	LVDS_TX2_P	P5_2		44	MIPI_CSI-A_CLK_P
20	LVDS_CLK_N	P5_1		45	MIPI_CSI-A_D2_N
21	LVDS_CLK_P	P5_0		46	MIPI_CSI-A_D2_P
22	LVDS_TX3_P	NOT AVAILABLE		47	MIPI_CSI-A_D3_N
23	LVDS_TX3_N			48	MIPI_CSI-A_D3_P
24	GND		GND	49	QSPI_CS2	NOT AVAILABLE	QSPI interface
25				50	GND		GND
J405 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	GND		GND	26	GND		GND
2	PCIE-B_RX_N	NOT AVAILABLE	PCIE-B interface	27	TXCLK	P2_0	Ethernet interface
3	PCIE-B_RX_P			28	TXD0	P2_4
4	PCIE-B_WAKE			29	TXD1	P2_5
5	GND		GND	30	TXD2	P2_6
6				31	TXD3	P2_7
7	SATA-B_RX_N	NOT AVAILABLE	SATA-B interface	32	TXDEN	P2_2
8	SATA-B_RX_P			33	INT/COL	P1_14
9	GND		GND	34	GND		GND
10	SATA-A_RX_N	NOT AVAILABLE	SATA-B interface	35	PCIE-A_CLK_N	NOT AVAILABLE	PCIE-A interface
11	SATA-A_RX_P			36	PCIE-A_CLK_P
12	GND		GND	37	PCIE-A_TX_N
13	PCIE-A_RX_N	NOT AVAILABLE	PCIE-A interface	38	PCIE-A_TX_P
14	PCIE-A_RX_P			39	GND		GND
15	PCIE-A_WAKE			40	SATA-A_TX_N	NOT AVAILABLE	SATA-A interface
16	MDC	P5_9	Ethernet interface	41	SATA-A_TX_P
17	MDIO	P7_13		42	GND		GND
18	REFCLK/CRS	P2_3		43	SATA-B_TX_N	NOT AVAILABLE	SATA-B interface
19	RXDV	P3_6		44	SATA-B_TX_P
20	RXD3	P7_12		45	GND		GND
21	RXD2	P2_10		46	PCIE-B_CLK_N	NOT AVAILABLE	PCIE-B interface
22	RXD1	P2_9		47	PCIE-B_CLK_P
23	RXD0	P2_8		48	PCIE-B_TX_N
24	RXCLK	P3_4		49	PCIE-B_TX_P
25	GND		GND	50	GND		GND
J406 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	BUCK-A_3V3	uOMIC BUCK8	uOMIC BUCK8	26	GND		GND
2				27	GPIO07	P7_3	GPIOs
3	BUS_1WIRE	BUS_1WIRE	1-WIRE interface	28	GPIO08	P7_1
4	GND		GND	29	GPIO09	P7_11
5	GPIO40	NOT AVAILABLE	GPIOs	30	GPIO10	P3-9
6	GPIO39			31	GPIO11	P0_4
7	GPIO38			32	GPIO12	NOT AVAILABLE
8	LDO-D	uOMIC OUT14	uOMIC OUT14 LDO	33	GPIO13
9	GND		GND	34	GPIO14
10	GPIO37	NOT AVAILABLE	GPIOs	35	GPIO15	P1_6
11	GPIO36			36	GPIO16	P1_7
12	GPIO35			37	GPIO17	P7_10
13	GPIO34			38	GPIO18	P7_14
14	GPIO33			39	GPIO19	P8_1
15	GPIO32			40	GPIO20	NOT AVAILABLE
16	GPIO31			41	GPIO21
17	GPIO30			42	GPIO22
18	GND		GND	43	GPIO23	P8_2
19	MIPI_CSI-B_D1_P	NOT AVAILABLE	MIPI camerainterface B	44	GPIO24	P8_0
20	MIPI_CSI-B_D1_N			45	GPIO25	P7-15
21	MIPI_CSI-B_CLK_P			46	GPIO26	P8_7
22	MIPI_CSI-B_CLK_N			47	GPIO27	P4_9
23	MIPI_CSI-B_D0_P			48	GPIO28	NOT AVAILABLE
24	MIPI_CSI-B_D0_N			49	GPIO29
25	GND		GND	50	GND		GND
J407 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	GND		GND	26	GND		GND
2				27	SDIO-B_DATA1	P4_1	SDIO-B interface
3	LDO-Q_1V8	uOMIC OUT13	uOMIC OUT13 LDO	28	AUX_CLK	NOT AVAILABLE
4	LDO-R_2V8	uOMIC OUT22	uOMIC OUT22 LDO	29	SDIO-B_DATA2	P4_2
5	SDIO-D_CMD	NOT AVAILABLE	SDIO-D interface	30	AUX_CDN	NOT AVAILABLE
6	SDIO-D_CLK			31	SDIO-B_DATA0	P4_0
7	SDIO-D_DATA2			32	AUX_CMD	NOT AVAILABLE
8	SDIO-D_CDN			33	SDIO-B_DATA3	P4_3
9	SDIO-D_DATA1			34	SDIO-A_DATA0	P3_11	SDIO-A interface
10	SDIO-D_DATA0			35	SDIO-A_DATA1	P3_10
11	SDIO-D_DATA3			36	SDIO-A_CLK	P3_12
12	GND		GND	37	SDIO-A_DATA2	P3_15
13	uOMIC_1WIRE	uOMIC_1WIRE	uOMIC 1-WIRE bus	38	SDIO-A_DATA3	P3_14
14	USB-C_HOST_OC	NOT AVAILABLE	USB interface C	39	SDIO-A_CDN	P3_8
15	USB-C_HOST_EN			40	SDIO-A_CMD	P3_13
16	GND		GND	41	SDIO-C_DATA3	P4_14	SDIO-C interface
17	USB-B_HOST_N	USBDN2_DN	USB interface B	42	SDIO-C_CLK	P4_12
18	USB-B_HOST_P	USBDN2_DP		43	SDIO-C_DATA1	P4_10
19	GND		GND	44	SDIO-C_DATA2	P4_15
20	USB-C_HOST_N	USBDN3_DN	USB interface C	45	SDIO-C_CMD	P4_13
21	USB-C_HOST_P	USBDN3_DP		46	SDIO-C_DATA0	P4_11
22	GND		GND	47	SDIO-C_CDN	P4_8
23	USB-A_HOST_N	USBDN1_DN	USB interface A	48	VSYS	VSYS	uOMIC power input
24	USB-A_HOST_P	USBDN1_DP		49
25	GND		GND	50
J408 Connector
Pin Nº	Pin name	IC Signal	Description	Pin Nº	Pin name	IC Signal	Description
1	GND		GND	26	VSYS	VSYS	uOMIC power input
2				27
3	BAT_RTC	BAT_RTC	uOMIC RTC power input	28
4	RFU	NOT AVAILABLE	Reserved	29
5				30	LDO-E	uOMIC OUT25	uOMIC OUT25 LDO
6				31	LDO-F	uOMIC OUT21	uOMIC OUT21 LDO
7				32	LDO-G	uOMIC OUT26	uOMIC OUT26 LDO
8	CLK32K_0_REF	CLK32K_0_REF	CLK32K_0 reference voltage input	33	LDO-H	uOMIC OUT19	uOMIC OUT19 LDO
9	CLK32K_1_REF	CLK32K_1_REF	CLK32K_1 reference voltage input	34	LDO-I	uOMIC OUT23	uOMIC OUT23 LDO
10	CLK32K_0	CLK32K_0	32.768 KHz CLK output 0	35	LDO-J_3V0	uOMIC OUT12	uOMIC OUT12 LDO
11	CLK32K_1	CLK32K_1	32.768 KHz CLK output 1	36	LDO-K	uOMIC OUT24	uOMIC OUT24 LDO
12	PWR_ON	PWR_ONr	System power ON	37	LDO-L	uOMIC OUT16	uOMIC OUT16 LDO
13	GND		GND	38	LDO-M_1V8	uOMIC OUT20	uOMIC OUT20 LDO
14				39	LDO-N	uOMIC OUT09	uOMIC OUT09 LDO
15	#PMIC_RST_1	#PMIC_RST_1	uOMIC reset	40	LDO-O_1V8	uOMIC OUT11	uOMIC OUT11 LDO
16	#PMIC_RST_0	#PMIC_RST_0		41	BUCK-A_3V3	uOMIC BUCK8	uOMIC BUCK8
17	BOOT_SW1	P7_0	Booting interface	42
18	BOOT_SW5	BSCANP		43
19	BOOT_SW3	P0_1		44	LDO-P	uOMIC OUT10	uOMIC OUT10 LDO
20	BOOT_SW2	P0_3		45	VDDIO	uOMIC OUT12	uOMIC OUT12 LDO
21	BOOT_SW4	P0_2		46	BUCK-B_3V3	uOMIC BUCK9	uOMIC BUCK9
22	BOOT_SW0	P0_0		47
23	GND		GND	48
24				49
25	VSYS	VSYS	uOMIC power input	50

Power

For the Renesas RZ/A1H – RZ/A1M power management has been used the Tecnofingers uOMIC Integrated Circuit. This powerful and tinny Power Management Integrated Circuit (PMIC) is configured for both supply all the needed power lines for accomplishing the Rhomb.io S400 Standard, and also to provide to the system the required power for the internal chips. The PMIC power input is provided through VSYS, a signal available on the Rhomb.io Standard connectors J407 and J408.

More details regarding the Tecnofingers uOMIC IC can be found at the manufacturer documentation.

This Rhomb.io Core Module also includes a low noise and low ripple 5V-output Step-Up IC for the USB2.0. This switched power supply can provide a maximum of 240 mA to the OTG VBUS. Take care to not connect any device on the VBUS line that may overcome this value.

The next table shows the features of each one of the power supply signals that are available on the Rhomb.io Core Connectors J402, J404, J406, J407 and J408. Pinout according to the Rhomb.io Standard.

Power outputs
Power supply	Connector	Pin	Def. Voltage (V)	Max. Current (mA)	Def. State	Type
VDDIO	J408	45	3.3	300	ON	Fixed
LDO-A_2V8	J402	23	2.8	150	ON	Fixed
LDO-B	J402	24	1.8	150	ON	Regulable
LDO-C	J404	4	1.2	300	OFF	Regulable
LDO-D	J406	8	1.8	150	ON	Regulable
LDO-E	J408	30	3.0	150	OFF	Regulable
LDO-F	J408	31	2.8	300	ON	Regulable
LDO-G	J408	32	3.0	150	OFF	Regulable
LDO-H	J408	33	1.8	150	OFF	Regulable
LDO-I	J408	34	3.0	300	OFF	Regulable
LDO-J_3V0	J408	35	3.0	150	ON	Fixed
LDO-K	J408	36	3.0	150	OFF	Regulable
LDO-L	J408	37	1.8	150	ON	Regulable
LDO-M_1V8	J408	38	1.8	150	ON	Fixed
LDO-N	J408	39	1.8	150	OFF	Regulable
LDO-O_1V8	J408	40	1.8	150	ON	Fixed
LDO-P	J408	30	3.0	300	ON	Regulable
LDO-Q_1V8	J407	3	1.8	150	ON	Fixed
LDO-R_2V8	J407	4	2.8	300	ON	Fixed
BUCK-A_3V3	J406	1	3.3	1500	OFF	Fixed
		2
	J408	41
		42
		43
BUCK-B_REG	J408	46	3.3	1500	OFF	Regulable
		47
		48
		49
		50

Note that each pin on the Rhomb.io Standard connector supports a maximum of 300 mA. The VSYS signal is the PMIC input, while the other signals are all outputs.

The next table shows the features of each one of the power input pins on the Rhomb.io Core Connectors. The pinout corresponds to the Rhomb.io Standard.

Power inputs
Power input	Connector	Pin	Min Voltage (V)	Max Voltage (V)	Max Current (A)
VSYS	J407	48	3.3	5.5	2.4
		49
		50
	J408	25
		26
		27
		28
		29

Finally, the following table summarises the different power rails used internally on the Renesas RZ/A1H – RZ/A1M Rhomb.io Core.

Core internal power
Voltage (V)	Device	Power pin	Current (mA)	Test conditions	uOMIC output	Total max. current (mA)
3.3	SoC	PVcc	100	Max.	BUCK5	543.71
		AVcc	4	During A/D conversion
		AVref	1
		LVDSAPVcc	48	During LVDS transfer
		USBAPVcc	4	USB in use
		VDAVcc	60	Max.
	Flash memory 1	Vcc	100	Max.
	Flash memory 2	Vcc	100	Max.
	Reset	Vcc	0.0025	Max.
	Oscil 12MHz	Vcc	4.5	Max.
	UART switch	Vcc	50	Max.
	USB Hub	VBAT	72	Max.
	Pull-ups		0.2	Max.
1.18	SoC	Vcc	850	Max.	BUCK3	866.5
		PLLVcc	8	Max.
		LVDSPLLVcc	2.5	Max.
		USBAVcc	6	USB in use
1.8	Step-up	EN	NA		LDO03	72.35
	Pull-ups		0.34	Max.
	USB hub	VDD_CORE_REG	72	Max.
2	uOMIC	INL2	750	Max.	BUCK7	750
	uOMIC	INL5	750	Max.	BUCK1	750
3 – 5.5	Step-up	VIN	140	Max.	VSYS	8150.55
	uOMIC	INB1	750	Max.
		INB3	866.5	Max.
		INB5	543.71	Max.
		INB7	1050.34	Max.
		INB8	1500	Max.
		INB9	1500	Max.
		INL4	750	Max.
		INL6	900	Max.
		INL7	150	Max.

Mechanical specifications

Warranty

• Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:

1. The users should wear anti-static clothing and use earth band when manipulating the device.
2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
3. Equipment and work table must be earthed.
4. Ionizer is recommended to remove electron charge.

• Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.

• Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.

• Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.

• Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.

• Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.

• Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.

• EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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