Kinetis K81

41,61

Out of stock

The Kinetis® K81 MCU extends the Kinetis MCU portfolio with advanced security capabilities including anti-tamper peripheral, boot ROM to support encrypted firmware updates, automatic decryption from external serial flash memory, AES acceleration, and hardware support for public key cryptography. The K81 MCU can be used to meet the security standards for point-of-sale (PoS) applications.

Out of stock

The S200 Master Module – Kinetis K81  is a certified Rhomb.io master module that contains a 32 bit ARM MCU. It can be mounted whith Kinetis K81 MCU from NXP, all of them with advanced security capabilities. For more information look at NXP web: (K81)

The Kinetis® K81 MCU extends the Kinetis MCU portfolio with advanced security capabilities including anti-tamper peripheral, boot ROM to support encrypted firmware updates, automatic decryption from external serial flash memory, AES acceleration, and hardware support for public key cryptography. The K81 MCU can be used to meet the security standards for point-of-sale (PoS) applications.

Applications

  • Point-of-sale (POS)
  • Smart Watches
  • Smart Metering
  • Building control
  • Home automation and security
  • loT data concentrators
  • Portable healthcare
  • Smart energy gateways
  • Wearable Healthcare Patch

Specifications

MicrocontrollerNXP Kinetis MK81FN256VDC15 32-bit ARM Cortex-M4 & FPU, 48-150 MHz & 32 KHz
Internal MemoryUp to 256 KB Flash, up to 256 KB SRAM, 32 KB ROM
External MemoryUp to 16 KB QSPI Flash Memory
Encryption Memory16 Keys/ECDSA/ECDH/SHA-256/SMAC/NIST
ID Memory64-bit Unique-ID Memory with 112 B User EEPROM (Optional)
Others•JTAG/SWD micro connector
•Native USB OTG & USB switch
MCU SecurityAnti-Tamper (K81 and KL81) Unique ID/AES/DES/2ES/RSA/ECC/SHA/HRNG/TRNG
rhomb.io Configuration2xUSB / 4xUART / SPI / 2xI2C / SDIO / QSPI / SAI / 5xINT / 4xPWM / up to 33xGPIO / 7xAD / DAC
MCU I/OUp to 87xI/O (up to 16xPWM / up to 24xADC / up to 85xINT / SAI / SDIO / QSPI)
Op. Voltage1.8 V / 2.8 V / 3.3 V
Op. Temperature-40 ºC to +85 ºC

Documentation

3D View

S200 Master Module - Kinetis K8x TOP3D.jpg

S200 Master Module - Kinetis K8x BOT3D.jpg

Applications

  • Point-of-sale (POS)
  • Smart Watches
  • Smart Metering
  • Building control
  • Home automation and security
  • loT data concentrators
  • Portable healthcare
  • Smart energy gateways
  • Wearable Healthcare Patch

Module specification

MCU

As we can see in the table above, the S200 Master Module – Kinetis K81 v2.0 has 76 digital input/output pins (most of them used as analog inputs, PWM, I2C, LPUART, I2S, etc.) and a USB 2.0 OTG interface which can be used, for example, to control some slave modules, to program the MCU, to read/write a USB memory, to communicate with a host computer (or a RHOMB core), etc.

Main clock uses the onboard 12 MHz resonator in combination with the internal PLL/FLL to generate the system clock, several frequencies supported.

This MCU contains 121 pins. The Pin Mapping is the next:

PINMAPPING.JPG

PROCESSOR

The S200 Master Module – Kinetis K81 v2.0 includes a low-power microcontroller which uses an ARM Cortex M4 processor. The Cortex-M4 processor is developed to address digital signal control markets that demand an efficient, easy-to-use blend of control and signal processing capabilities. The combination of high-efficiency signal processing functionality with the low-power, low cost and easy-of-use benefits of the Cortex-M family of processors is designed to satisfy the emerging category of flexible solutions specifically targeting the motor control, automotive, power management, embedded audio and industrial automation markets. These are the main features of this processor:

-Architecture Armv7E-M Harvard.

-ISA Support: Thumb/Thumb-2.

-Pipeline : 3Stage + branch speculation

-DSP Extensions : Single cycle 16/32-bit MAC || Single cycle dual 16-bit MAC || 8/16-bit SIMD arithmetic || Hardware Divide (2-12 Cycles).

-Floating-Point Unit: Optional single precision floating point unit IEE 754 compliant.

-Memory Protection: Optional 8 region MPU with sub regions and background region.

-Interrupts: Non-Maskable Interrupt (NMI+ 1 to 240 physical interrupts).

-Debug: Optional JTAG and Serial Wire Debug ports. Up to 8 breakpoints and 4 watchpoints.

MCU FEATURES

This MCU is able to use :

– FlexBus external bus interface and SDRAM controller.

-Dual QuadSPI with OTF decryption and XIP

-Two 6-bit DAC and one 12-bit DAC.

-USB full-/low-speed On-the-Go controller

-Secure Digital Host Controller and FlexIo

-One I2S Module, Three SPI, four I2C and five LPUART modules.

-32kHz and 3 to 32 MHz crystal oscillators.

-Timers, interruptions, PWMs.

POWER

Regarding the power supply, the device has several different power supply pins:

-Vdd: Supply voltage.

-Vddio_e: Independet Supply voltage for PORT_E.

-Vdda: Analog supply voltage.

-Vbat: RTC battery supply voltage.

The Voltage Range of these power supply sources is 1.71V to 3.6V. Vdda must be connected to VDD potential.

-Vss: Ground.

-Vssa: Analog ground. It must be conected to Vss.

There is also:

-USB_Vdd (Vout33): It depends on the Kinetis K8x or KL8x family. In this module, it is an output voltage.

-USB_Vss: Connected to Vss.

VDDIO_E is independent of the VDD domain and can operate at a voltage independet of VDD. However, it is required that the VDD comain be powered up before VDDIO_E. VDDIO_E must never be higher than VDD. They may ramp together if are tied to the same power supply.

Input Voltage supply includes ADC, CMP and RESET_b inputs.

PORT_E analog input voltages cannot exceed VDD supply.

VBAT domain pins include EXTAL32, XTAL32, RTC_WAKEUP_b and Tamper pins.

In the S200 Master Module – Kinetis K81 v2.0 the power source comes from the Rhomb.io module connectors. The source used is DVCC. To supply “DVCC”, we can use “3V3”, “2V8” or “1V8”. Each power source is connected by a solder jumper so you can choose “DVCC” by soldering one of the solder jumpers,”3V3″, “2V8” or “1V8”. By default the solder jumper of the 3V3 power source is soldered, so the entire Module is powered at 3V3.

BLOCK DIAGRAM

The next figure shows the Block Diagram for the S200 Master Module – Kinetis K81 v2.0.

Kinetis K81 Diagram.png (Under construction)

Solder Jumpers

There are three Solder Jumpers used to choose the power source for “DVCC”, as it was mentioned before. There are three options :

-“1V8″(SJ3)

-“2V8″(SJ2)

-“3V3″(SJ1)

As we can see in the image below:

S200 Master Module - Kinetis K8x SOLDERJUMPERS.JPG

Pin Mapping

The MCU pins have more than one configuration. In the table below we show the posible functions:

Pin Functions Pin Function Pin Function
A1-PTD7 CMT/UART0_TX/FTM0_CH7/SDRAM_CKE/SPI1_SIN D8-PTC1 LLWU_P6/ADC0_SE15/SPI0_CS3/I2S0_TXD0/FXIO0_D13 H4-PTD15 SPI2_CS1/FXIO0_D31
A2-PTD5 ADC0_SE6B/SPI0_CS2/UART0_CTS/FTM0_CH5/FB_AD1/SPI1_SCK D9-PTB18 I2S0_TX_BCLK/FXIO0_D6 H5-TAMPER4 TAMPER4
A3-PTD4 LLWU_P14/SPI0_CS1/UART0_RTS/FTM0_CH4/FB_AD2/EWM_IN D10-PTB10 SPI1_CS0/UART3_RX/I2C2_SCL/FXIO0_D4 H6-TAMPER3 TAMPER3
A4-PTC19 UART3_CTS/FB/SDRAM_DQM0 D11-PTB8 EMVSIM1_RST/FB/SDRAM H7-PTA11 LLWU_P23/I2C2_SCL/FXIO0_D17
A5-PTC14 UART4_RX/FB_AD25/SDRAM_D25/FXIO0_D20 E1-PTE6 LLWU_P16/I2S0_MCLK/QSPI0B_D3/SDHC0_D4 H8-PTA1 JTAG_TDI/UART0_RX/I2C/FXIO0_D11
A6-PTC13 UART4_CTS/FTM_CLKIN1/FB_AD26/SDRAM_D26/TPM_CLKIN1 E2-PTE5 SPI1_CS0/UART3_RX/SDHC0_D2/QSPI0A_SS H9-PTA3 JTAG_TMS_SWDIO/FXIO0_D13/EMVSIM_RST
A7-PTC8 CMP0_IN2/I2S0_MCLK/FB_AD7/SDRAM_A16/FIO0_D15 E3-PTD11 SPI2_CS0/FXIO0_D27 H10-PTA17 I2S0_MCLK/FXIO0_D23/SPI0
A8-PTC4 LLWU_P8/SPI0_CS0/UART1_TX/FTM0_CH3 E4-PTD10 FXIO0_D26/FB H11-PTA29 FB
A9-PTD9 I2C0_SDA/FB/FXIO0_D25 E5-VDDIO_E VDDIO_E J1-VOUT33 VOUT33
A10-PTD8 LLWU_P24/I2C0_SCL/FB/FXIO0_D24 E6-VDD VDD J2-VREGIN VREGIN
A11 NC E7-VDD VDD J3-TAMPER6 TAMPER6
B1-PTE0 SPI1_CS1/UART1_TX_SDHC0_D1/QSPIOA_D3/I2C1_SDA/RTC_CLKOUT E8-PTB23 SPI2_SIN/FB/FXIO0_D11 J4-TAMPER2 TAMPER2
B2-PTD6 LLWU_P15/ADC0_SE7B/SPI0_CS3/UART0_RX/FB_AD0 E9-PTB17 UART0_TX/SPI1_SIN/FB/SDRAM/TPM J5-TAMPER1 TAMPER1
B3-PTD3 UART2_TX/FTM3_CH3/FB_AD3/I2C0_SDA E10-PTB9 SPI1_CS1/FB/SDRAM J6-TAMPER5 TAMPER5
B4-PTC18 UART3_RTS/FB/SDRAM_DQM1 E11-PTB7 EMVSIM1_PD/FB/SDRAM J7-PTA2 JTAG_TDO_SWO/UART0_TX
B5-PTC15 UART4_TX/FB/FXIO0_D21 F1-PTE9 LLWU_P17/I2S0_TXD1/I2S0_RX_BCLK/QSPI0B_D2/SDHC0 J8-PTA4 LLWU_P3/#NMI_b/FXIO0_D14
B6-PTC12 UART4_RTS/FTM_CLKIN0/FB/TPM_CLKIN0 F2-PTE8 I2S0_RXD1/SPI2_SOUT/I2S0_RX_FS/QSPI0B_D0/SDHC0 J9-PTA10 LLWU_P22/I2C2_SDA/FXIO0_D16
B7-PTC7 UART3_TX/FB/SDRAM_DQM3 F3-PTE7 SPI2_SCK/I2S0_RXD0/QSPI0B_SCLK/QSPI0A_SS J10-PTA16 I2S0_RX_FS/FXIO0_D22/SPI0_OUT
B8-PTC3 LLWU_P7/SPI0_CS1/UART1_RX/I2S0_TX_BCLK F4-PTD12 SPI2_SCK/FB/FXIO0_D28 J11-RESET_b RESET_b
B9-PTC0 ADC0_SE14/SPI0_CS4/USB0_SOF_OUT/I2S_TXD1/FXIO0 F5-VDDA VDDA K1-ADC0_DM0 ADC0_DM0
B10-PTB16 SPI1_SOUT/UART0_RX/FB/SDRAM/EWM F6-VSSA VSSA K2-ADC0_DP0 ADC0_DP0
B11-PTB4 EMVSIM1_IO/SDRAM_CS1/FTM1_FLT0 F7-VSS VSS K3-TAMPER7 TAMPER7
C1-PTE2 LLWU_P1/SPI1_OUT/UART1_CTS/SDHC0/QSPI0A_D0 F8-PTB22 SPI2_SOUT/FB(SDRAM/FXIO0_D10 K4-DAC0_OUT DAC0_OUT
C2-PTE1 LLWU_P0/SPI_SCK/UART1_RX/SDHC_D0/QSPI0A_SCLK/I2C1_SCL F9-PTB21 SPI2_SCK/FB/SDRAM/CMP1:OUT/FXIO0_D9 K5-TAMPER0 TAMPER0
C3-PTD2 LLWU_P13/SPI0_OUT/UART2_RX/FTM3_CH2/I2C0_SCL F10-PTB20 SPI2_CS/FB/SDRAM/CMP0_OUT/FXIO0_D8 K6-VBAT VBAT
C4-PTC17 UART3_TX/FB/SDRAM F11-PTB6 EMVSIM1_VCCEN/FB/SDRAM K7-PTA5 I2C/EIC/SCOM1PAD0+/TC2
C5-PTC11 LLWU_P11/I2C1_SDA/I2S0_RXD1/FXIO0_D19 G1-PTE11 I2C3_SCL/SPI2_CS/I2S0_TX_FS/QSPI0B_SS K8-PTA12 FXIO0_D18/I2S0_TXD0
C6-PTC10 I2C1_SCL/I2S0_RX_FS/FB/SDRAM/FIO0_D18 G2-PTE10 LLWU_P18/I2C3_SDA/I2S0_TXD0/SPI2/QSPI0B_D1/SDHC0_D7 K9-PTA14 SPI0_CS/UART0_TX/FXIO0_D20/I2S0_BCLK
C7-PTC6 LLWU_P10/SPI0_SOUT/I2S_RX_BCLK/FXIO_D14 G3-PTD13 SPI2_SOUT/FB/FXIO0_D29 K10-VSS VSS
C8-PTC2 ADC0_SE4B/SPI0_CS2/UART1_CTS/FTM0_CH1/I2S_TX_FS G4-PTD14 SPI2_SIN/FB/FXIO0_D30 K11-PTA19 XTAL0
C9-PTB19 I2S_TX_FS/FB/FXIO0_D7 G5-VREFH VREFH L1-ADC0_DM1 ADC0_DM1
C10-PTB11 SPI1_SCK/UART3_TX/I2C2_SDA/FXIO0_D5 G6-VREFL VREFL L2-ADC0_DP1 ADC0_DP1
C11-PTB5 EMVSIM1_CLK/FTM2 G7-VSS VSS L3-VREF_OUT VREF_OUT
D1-PTE4 LLWU_P2/SPI1_SIN/UART3_TX/SDHC0_D3/QSPI0A_D1 G8-PTB3 ADC0_SE13/I2C0_SDA/SDRAM/FXIO0_D3 L4- XTAL32 XTAL32
D2-PTE3 SPI1_CS2/UART1_RTS/SDHC0_CMD/QSPI0A_D2 G9-PTB2 ADC0_SE12/I2C0_SCL/SDRAM/FXIO0_D2 L5-EXTAL_32 EXTAL_32
D3-PTD1 ADC0_SE5B/SPI0_SCK/UART2_CTS/FB/FXIO0_D23 G10-PTB1 ADC0_SE9/I2C0_SDA/SDRAM/FXIO0_D1 L6-VSS VSS
D4-PTD0 LLWU_P12/SPI0_CS0/UART2_RTS/FB/FXIO0_D22 G11-PTB0 ADC0_SE8/LLWU_P5/I2C0_SCL/SDRAM/FXIO0_D0 L7-PTA0 JTAG_CLK/FXIO0_D10
D5-PTC16 UART3_RX/FB/SDRAM H1-USB0_DM USB0_DM L8-PTA13 LLWU_P14/FXIO0_D19/I2S0_TX_FS
D6-PTC9 CMP0_IN3/I2S0_RX_BCLK/FB/FXIO0_D17 H2-USB0_DP USB0_DP L9-PTA15 SPI0_SCK/UART0_RX/FXIO0_D21/I2S0_RXD0
D7-PTC5 LLWU_P9/SPI0_SCK/I2S0_RXD0 H3- VSS VSS L10-VDD VDD
L11-PTA18 EXTAL0

In The S200 Master Module – Kinetis K81 v2.0 the pin configuration is the next:

Functionality Signal MCU Pin Functionality Signal MCU Pin
UART UART-A_TXD K9 SPI-A MISO B3
UART-A_RXD B10 MOSI C3
UART-B_RXD B8 CLK D3
UART-B_TXD A8 CSN(CS0) D4
UART-C_RXD D5 CSN(CS1) A3
UART-C_TXD C4 CSN(CS2) C8 **
UART-D_RXD A5 INT INT0 E3
UART-D_TXD B5 INT1 E4
I2C-A SDA A9 INT2 H4
SCL A10 INT3 A6
I2C-B SDA C5 PWM PWM0 J9
SCL C6 PWM1 H7
#NMI #NMI J8 PWM2 K8
JTAG SWCLK L7 PWM3 L8
SWDIO H9 XTAL XTAL-IN L4
SWO J7 XTAL-OUT L5
TDI H8 XTAL0-IN K11
TRST K7 XTAL0-OUT L11
QSPI CLK F3 SDIO CLK C1
Data0 F2 CMD D2
Data1 G2 Data0 C2
Data2 F1 Data1 B1
Data3 D1 Data2 E2
CS0 G1 Data3 D1
CS1 C8** LED LED1 H11
CS2 D9
GPIO-A IO0 E8 GPIO-B IO8 A4
IO1 E9 IO9 C11
IO2 F9 IO10 B11
IO3 F10 IO11 B9
IO4 G11 IO12 D11
IO5 G10 IO13 D10
IO6 G9 IO14 C10
IO7 G8 IO15 E11
GPIO-C IO16 D7 RESET RST J11
IO17 J10 RST_OUT A1
IO18 E10 IO 1WIRE C9
IO19 H10 USB USB_SW F11
SAI(I2S) SAI_MCLK A7 USB_P H2**
SAI_BCLK C7 USB_N H1**
SAI_LRCLK B7 OTG_N H1**
SAI_SDO D8 OTG_P H2**
SAI_SDI L9 OTG_ID F8
AD DAC0 K4 AD AD3 K2
AD0 B2 AD4 L1
AD1 A2 AD5 L3
AD2 K1 AD6 L2
GND GND F7 GND AGND F6
GND G7 AGND G6
GND H3 GND L6
GND K10
POWER VDD E5 POWER USB_VDD (3V3) J1
VDD E6 VREG J2
VDD E7 AREF G5
VDDA F5 VRTC K6

It is important to mention that some pins of the MCU are being shared by more than one signal. These pins are:

-C8: This pin is used by the SPI-A_CS2 and the QSPI-A_CS1. These signals are connected by a Resistor bridge.

See the image below:

S200 Master Module - KinetisK8x BRIDGE QSPI-SPI.JPG

-H1: This pin’s function is only for USB_N/OTG_N.

-H2: This pin’s function is only for USB_P/OTG_N.

In the Rhomb.io “S200 Master Module – Kinetis K81 v2.0” it is possible to use two USB connections. The first USB is used to work as a normal USB connection. The second USB makes it possible to work as a USB host (OTG). This MCU only has one USB port so the “S200 Master Module – Kinetis K81 v2.0” includes a UART SWITCH to make it possible change the USB to OTG.

See the image below:

S200 Master Module - KinetisK8x USB SWITCH.JPG

As we can see in the images below:
PWR_VREF_CLK

S200 Master Module - KinetisK8x PORTPWR.JPG

S200 Master Module - KinetisK8x PORTA-B.JPG
PORT A-B

PORT C-D

S200 Master Module - KinetisK8x PORTC-D.JPG

PORT USB_AD

S200 Master Module - KinetisK8x PORTAD USB.JPG

LED

There is a green LED on the board assembled for user purposes. As it can be seen on the Schematics, the anode is connected to the power Source (DVCC) by a 75 Ohm Resistor. The cathode is connected to Q1(the transistor). There is a GPIO signal (LED1) connected to the Gate G of the transistor, this GPIO is used to turn on or turn off the LED.

S200 Master Module - Kinetis K8x LED1.JPG

ID Memory

The DS28E05 is a 112-byte user-programmable EEPROM organized as 7 pages of 16 bytes each. Memory pages can be individually set to write protected or EPROM emulation mode through protection byte settings. Each part has its own guaranteed unique 64-bit ROM identification number (ROM ID) that is factory programmed into the chip.

Applications:

  • Accessory/PCB Identification
  • Medical Sensor Calibration Data Storage
  • Analog Sensor Calibration
  • Aftermarket Management of consumables

Features:

  • Single-contact 1-Wire Interface
  • 112 Bytes User EEPROM with 1k Write Cycles
  • Programmable Write Protection and OTP EPROM Emulation Modes for User Memory
  • Unique Factory-Programmed 64-Bit ROM ID Number
  • Operating Range: 1.71V to 3.63V, -40ºC to +85ºC

The configuration in the S200 Master Module – Kinetis K8x is shown in the next image:
S200 Master Module - Kinetis K8x IDMEMORY.JPG

Security

The S200 Master Module – Kinetis K81 has a Cryptographic Co-processor with Secure Hardware-based Key Storage. It is the ATECC508A. It has a 2.0V to 5.5V Supply Voltage Range, and a 1.8V to 5.5V IO levels range. Its configuration is shown in the image below:

S200 Master Module - KinetisK8x SECURITY.JPG

QSPI Memory

The “S200 Master Module – Kinetis K81 v2.0” includes a QSPI memory. The W25Q128JVPIQTR is the chosen memory. It is a 3V 128M-Bit Serial Flash Memory with Dual/Quad SPI. It is ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI(XIP) and storing voice, text and data.

Its array is organized into 65.536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128(32KG block erase), groups of 256(64KB block erase) or the entire chip.

The SPI clock frequencies of this device up to 133 MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHZ (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O.

The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1uA for power-down.

The memory connection is shown in the image below:

S200 Master Module - KinetisK8x QSPIMEMORY.JPG

The Power supply of the memory in this module is “DVCC”, so the memory would only work if “DVCC” is 3.3V

SWDIO

Connections

GPIO

The following table summarizes the GPIOs used on the S200 Master Module – Kinetis K81 v2.0. It is also indicated the possible functions that these GPIOs are able to have.

Rhomb.io pinout Signal Module Signal Fuctions Rhomb.io pinout Signal Module Signal Functions
GPIO-A IO0 IO0 SPI2_SIN/FB/FXIO0_D11 GPIO-B IO0 IO8 UART3_CTS/FB/SDRAM_DQM0
IO1 IO1 UART0_TX/SPI1_SIN/FB/SDRAM/TPM IO1 IO9 EMVSIM1_CLK/FTM2
IO2 IO2 SPI2_SCK/FB/SDRAM/CMP1:OUT/FXIO0_D9 IO2 IO10 EMVSIM1_IO/SDRAM_CS1/FTM1_FLT0
IO3 IO3 SPI2_CS/FB/SDRAM/CMP0_OUT/FXIO0_D8 IO3 IO11 ADC0_SE14/SPI0_CS4/USB0_SOF_OUT/I2S_TXD1/FXIO0
IO4 IO4 ADC0_SE8/LLWU_P5/I2C0_SCL/SDRAM/FXIO0_D0 IO4 IO12 EMVSIM1_RST/FB/SDRAM
IO5 IO5 ADC0_SE9/I2C0_SDA/SDRAM/FXIO0_D1 IO5 IO13 SPI1_CS0/UART3_RX/I2C2_SCL/FXIO0_D4
IO6 IO6 ADC0_SE12/I2C0_SCL/SDRAM/FXIO0_D2 IO6 IO14 SPI1_SCK/UART3_TX/I2C2_SDA/FXIO0_D5
IO7 IO7 ADC0_SE13/I2C0_SDA/SDRAM/FXIO0_D3 IO7 IO15 EMVSIM1_PD/FB/SDRAM
GPIO-C IO0 IO16 LLWU_P9/SPI0_SCK/I2S0_RXD0
IO1 IO17 I2S0_RX_FS/FXIO0_D22/SPI0_OUT
IO2 IO18 SPI1_CS1/FB/SDRAM
IO3 IO19 I2S0_MCLK/FXIO0_D23/SPI0

These are the different types of interrupt functions:

-NVIC: Nested Vectored Interrupt Controller. -AWIC: Asynchronous Wakeup Interrupt Controller. -NMI: Non Maskarable Interrupt. -LLWU: Low-Leakable Wakeup Unit.

For more details, look at the module specifications for the Rhomb.io standard.

Serial interfaces

The following table indicates the available serial interfaces on the Rhomb.io standard and which of them are in use. The table also shows the nomenclature used on the Rhomb.io standard for auxiliary connections and its corresponding on the schematic.

Signal (Rhomb.io) Signal (module) Used by Signal (Rhomb.io) Signal (module) Used by
I2C-A SPI
I2C-A_SDA all MCUs SPI_MISO all MCUs
I2C-A_SCL all MCUs SPI_MOSI all MCUs
I2C-B SPI_CLK all MCUs
I2C-B_SDA all MCUs SPI_CS0 all MCUs
I2C-B_SCL all MCUs SPI_CS1 all MCUs
SPI_CS2 all MCUs
UART-A USB
UART-A_RXD all MCUs USB_DATA_N USB slaves all MCUs
UART-A_TXD all MCUs USB_DATA_P USB slaves all MCUs
UART-B USB
UART-B_RXD all MCUs OTG_P USB host all MCUs
UART-B_TXD all MCUs OTG_N USB host all MCUs

The I2C pull-ups resistors (4K7) are mounted on the Rhomb.io Motherboards. For more details, look at the module specifications for the Rhomb.io standard.

S200 Master Module – Kinetis K81 v2.0 implements an USB switch selector controled by the uC that allows to connect with slaves modules(default) or computer host.

OTHER INTERFACEs

The next table shows the nomenclature used on the schematic and its corresponding on the rhomb standard for the Secure Digital Input Output (SDIO) and SPI Flash Interface (QSPI).

NOTE: SDIO interface is only available on K8x versions. In KL82 are just GPIOs.

Signal (Rhomb.io) Signal (module) Used by Signal (Rhomb.io) Signal (module) Used by
SDIO QSPI
SDIO_CMD SDIO_CMD K8x versions QSPI_CS0 QSPI_CS0 all MCUs
SDIO_CLK SDIO_CLK K8x versions QSPI_CLK QSPI_CLK all MCUs
SDIO_DATA0 SDIO_DATA0 K8x versions QSPI_IO0 QSPI_IO0 all MCUs
SDIO_DATA1 SDIO_DATA1 K8x versions QSPI_IO1 QSPI_IO1 all MCUs
SDIO_DATA2 SDIO_DATA2 K8x versions QSPI_IO2 QSPI_IO2 all MCUs
SDIO_DATA3 SDIO_DATA3 K8x versions QSPI_IO3 QSPI_IO3 all MCUs
SDIO_CDN NC NC QSPI_CS1 QSPI_CS1 all MCUs

The next table shows the nomenclature used on the schematic and its corresponding on the rhom standard for the Integrated Interchip Sound (I2S) interface.

NOTE: SAI interface is hardware supported on K8x versions and emulated throught FLEXIO lines on KL82.

Signal (Rhomb.io) Used by Signal (Rhomb.io) Used by
SAI
SAI-A_SDI K8x MCUs FLEXIO KL8x MCUs
SAI-A_SDO K8x MCUs FLEXIO KL8x MCUs
SAI-A_BCLK K8x MCUs FLEXIO KL8x MCUs
SAI-A_LRCLK K8x MCUs FLEXIO KL8x MCUs
SAI-A_MCLK K8x MCUs FLEXIO KL8x MCUs

For more details, look at the module specifications for the Rhomb.io standard.

The FlexIO is a highly configurable module providing a wide range of protocols including, but not limited to LPUART, I2C, SPI, I2S, Camera IF, LCD RGB, PWM/Waveform generation. The module supports programmable baud rates independent of bus clock frequency, with automatic start/stop bit generation. It also supports to work in VLPR, VLPW, Stop, and VLPS modes when clock source remains enabled.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (Rhomb.io) Signal (module) Voltage (V) Used
1V8 150mA 1V8 1.8 Selectable
2V8 150mA 2V8 2.8 Selectable
5V_USB USB/OTG 5 Selectable
VSYS VSYS 3 – 5.5 Yes
VBAT VBAT VBAT RTC power supply

PWM

Signal (Rhomb.io) Used by Pin
PWM
PWM0 ALL MCUs [J9] PTA10
PWM1 ALL MCUs [H7] PTA11
PWM2 ALL MCUs [K8] PTA12
PWM3 ALL MCUs [L8] PTA13

Other signals

On the following table it is shown the remaining signals from the Rhomb.io module connectors standard.

Signal (Rhomb.io) Signal (module) Used by
CLK_32KH CLK_32KH Selectable as RTC CLK input
AD_OUT NC NC
PWM_INT NC NC

For more details, look at the module specifications for the Rhomb.io standard.

S200 Master Module – Kinetis K81 v2.0 has an onboard RTC oscillator, but it can be removed and use the 32KH signal from Rhomb connector

KINETIS K8x & KL8x Differences

Here it is a summary of the main differences between all Rhomb.io Kinetis Modules.

Types & Visual Differentiation

There are other Rhomb.io Kinetis Modules.

It can be mounted whith Kinetis K80, K81, K82 and KL82 MCUs from NXP, all of them with advanced security capabilities. For more information look at NXP web: (K8x) and (KL8x)

The different variants of the S200 Master Module – Kinetis K81 v2.0 use the same MCU packaging, the ‘121 XFBGA'(K8X) or the ‘121 MAPBGA’ (KL8X).

The design of these modules allows the production of any of the Kinetis K8x and KL8x series with no physical difference between the Module except for the MCU of the PCB. To differentiate any of the different modules you can check the bottom part of the PCB.

S200 Master Module - Kinetis K8x BOTvisual.jpg

MCU

In each part of this document you can find the specific difference between the different Modules. Here there is a summary of all the differences they have:

Comparative
K80 K81 K82 KL81/KL82
MCU ARM Cortex-M4 ARM Cortex-M0
Max. Operating Frequency 150 MHz 74 MHz
Flash Memory 256 KB 128 KB
SRAM Memory 256 KB 96 KB
Operating voltage 1.7 – 3.6 V
Onboard system oscillator 12 MHz
Onboard RTC oscillator 32.768 KHz
I2C 2
SPI 1
QSPI 1
LPUART 4 2
I2S (SAI) 1 1 (Emulated)
SDIO 4 data bits not supported
Interrupt pins 3
PWM outputs 4
Analog Inputs 15 14 [1] 15 14 [1]
Digital I/O 76
USB USB 2.0 OTG

POWER

The main Power supply conditions are the same for every Module, but there are some important differences:

USB

– Pin J1 –> VOUT33 (voltaje output) in K8x 10k pull-down resistor is required. –> USB_VDD (USB PWR suppy). 2.2uF & 01.uF decoupling capacitors are required. – Pin J2 –> VREGIN (voltage input) in K8x 2.2uF & 01.uF decoupling capacitors are required. –> NC in KL8x

SIGNALS

SAI

I2S/SAI is no hardware supported on KL8x versions but it’s routed to FLEXIO configurable lines which can emulate it. This lines are controlled by DMA so it doesn’t consume core resources but data BUS and DMA.

UART

UART-C & UART-D are not available on KL8x version, so this lines are used as GPIO.

SDIO

KL8x version has no SDHC support, so this lines are just GPIO for that version.

Mechanical specifications

Board

Allviews kinetis.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

Rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the Rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

All brand names, trademarks and registered trademarks belong to their respective owners.

We are constantly striving to improve the quality of our technical notes. If you find an error or omission please let us know.

Email us at: info@rhomb.io