STM32L476 – Master Module

40,00

50 in stock

The STM32L476 is a rhomb.io S200 Master Module that includes the STM32L476 MCU, which is one of the ST Electronics ultra-low-power microcontrollers based on the high-performance ARM Cortex-M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating Point Unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

50 in stock

The STM32L476 is a rhomb.io S200 Master Module that includes the STM32L476 MCU, which is one of the ST Electronics ultra-low-power microcontrollers based on the high-performance ARM Cortex-M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating Point Unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

Applications:

  • Industrial automation
  • Sensing
  • Audio processing
  • IoT

Specifications

MicrocontrollerSTM32L476VGT6, 32-bit ARM Cortex-M4 & FPU, 80 MHz & 32 KHz
Internal Memory1 MB Flash, 128 KB SRAM
External Memory16 MB QSPI Flash Memory
Encryption Memory16 Keys/ECDSA/ECDH/SHA-256/SMAC/NIST
ID Memory64-bit Unique-ID Memory with 112 B User EEPROM (Optional)
OthersNative USB OTG & USB switch; JTAG/SWD micro connector
rhomb.io Configuration2xUSB / 3xUART / SPI / 2xI2C / SDIO / QSPI / SAI / CAN / 4xINT / 5xPWM / 26xGPIO / 8xAD
MCU I/O82xI/O (12xPWM / 16xADC / 16xINT / 2xSAI / SDIO / QSPI, CAN)
Op. Voltage1.8V / 2.8 V / 3.3 V
Op. Temperature-40 ºC to +85 ºC

Documentation

3D VIEW

S200 Master - STM32L476 Top.png           S200 Master - STM32L476 Bottom.png

MODULE SPECIFICATIONS

The STM32L476 mounts the STM32L476, a microcontroller of the ST STM32L4 series that performs an ARM Cortex-M4 with DSP instructions. This microcontroller can work in ultra-low-power at 1.8 V, at 2.8 V or at full usage at 3.3 V depending which solder-jumper is closed.

As stated above, it is implemented a full set of DSP instructions so this microcontroller can be used as a signal processor too. Also this microcontroller implements a CRC calculation unit that can be used as a memory protection unit for security applications, a random generator unit and a DMA controller. It has up to 1 MB flash memory and a SRAM memory up to 128 KB. Another external QSPI memory is added bring the module 16 MB of extra storage that can be used for firmware or data logging (this memory works between 2.7 V to 3.6 V, so if the 1.8 V solder-jumper is closed, it will not work. There are also a cryptoautentification memory used to give a security layer to all communications encrypting all the information that receives via I2C interface, and a 1-Wire EEPROM memory to give a unique ID to the module.

The communications interfaces that we can find at STM32L476 are: SDIO, CAN, SPI and QSPI, USB and OTG, UART, I2C, SAI, 1-Wire and JTAG. All of them are included in the Master module an can be used in a Rhomb.io Motherboard. Also this microcontroller counts with up 4 INT, 5 PWM, 26 GPIO and 8 AD.

An USB switch allows you to select between the USB port used in the communication with the computer through a Motherboard or the USB OTG port used to communicate with Slave modules in Class 2 Motherboard.

A 10 pin connector in added on the board to get access to the JTAG/SWDIO signals to program the uController and to flashing/debugging.

The following figure identifies the main components onboard.

S200 Master - STM32L476 Description.png

The next figure shows the block diagram for the STM32L476.

S200 Master - STM32L476 Block Diagram.png

USER INTERFACES

The following table indicates the available serial interfaces of the rhomb.io Standard used in this module. This table relates the interfaces of the rhomb.io Standard with the net names of the schematic and with the components to which they are connected.

Rhomb.io Interface Schematic Signal Component Component Pin Comments
CAN-A CAN-A_RX STM32L476 (U1) PD0
CAN-A_RX PD1
I2C-A D15/I2C-A_SCL STM32L476 (U1) PB8
Crypto Memory (U4) SCL
D14/I2C-A_SDA STM32L476 (U1) PB9
Crypto Memory (U4) SDA
I2C-B I2C-B_SCL STM32L476 (U1) PB13
I2C-B_SDA PB14
JTAG JTAG_TCK/SWCLK STM32L476 (U1) PA14
Debug Connector (J1) 9
INT2/JTAG_TDI STM32L476 (U1) PA15
D3/INT0/JTAG_TDO PB3
JTAG_TMS/SWDIO PA13
Debug Connector (J1) 8
D5/IO1/JTAG_TRST STM32L476 (U1) PB4
QSPI QSPI_CLK STM32L476 (U1) PE10
QSPI Memory (U5) CLK
QSPI_CS0 STM32L476 (U1) PB11
QSPI_MEM PA13
QSPI Memory (U5) /CS
Debug Connector (J1) 8
QSPI_IO0 STM32L476 (U1) PB12
QSPI_MEM (U5) DI(IO0)
Debug Connector (J1) 4
QSPI_IO1 STM32L476 (U1) PB16
QSPI_MEM (U5) DO(IO1)
Debug Connector (J1) 5
QSPI_IO2 STM32L476 (U1) PB14
QSPI_MEM (U5) IO2
QSPI_IO3 STM32L476 (U1) PB15
QSPI_MEM (U5) IO
SAI-A SAI-A_SDI STM32L476 (U1) PE6
SAI-A_SDO PE3
SAI-A_BCLK PE5
SAI-A_LRCLK PE4
SAI-A_MCLK PE2
SDIO SDIO_CLK STM32L476 (U1) PC12
SDIO-CDN PD15
SDIO_CMD PD2
SDIO-DATA0 PC8
SDIO-DATA1 PC9
SDIO-DATA2 PC10
SDIO-DATA3 PC11
SPI-A D11/SPI-A_MISO STM32L476 (U1) PA6
D12/SPI-A_MOSI PA7
D13/SPI-A_CLK PA5
D10/SPI-A_CS0 PB6
SPI-A_CS1 PB14
SPI-A_CS2 PB13
UART-A D0/UART-A_RXD STM32L476 (U1) PA3
Debug Connector (J1) 6
UART-A_TXD STM32L476 (U1) PA2
Debug Connector (J1) 7
UART-A_CTS STM32L476 (U1) PD3
UART-A_RTS PD4
UART-B UART-B_RXD STM32L476 (U1) PD6
UART-B_TXD PD5
UART-C UART-C_RXD STM32L476 (U1) PD9
UART-C_TXD PD8
UART-D UART-D_RXD STM32L476 (U1) PD9
UART-D_TXD PD8
USB USB_N STM32L476 (U1) PA11 USB_SW line (PE1)
must be LOW
USB_P PA10
OTG OTG_N STM32L476 (U1) PA11 USB_SW line (PE1)
must be HIGH
OTG_P PA10
  • I2C-B: “I2C_SCL” and “I2C_SDA” are connected to “SPI-A_CS2” and “SPI-A_CS1” respectively through 0R0 resistors. Make sure these lines are not used at the same time.
  • JTAG: ·JTAG_TDI”, “JTAG_TDO” and “JTAG_TRST” share line with “INT2”, “INT0” and “IO1” signals.
  • UART-C & UART-D: These interface are connected to the same pins of the STM32L476.

GPIO & CONTROL SIGNALS

The following table summarizes the GPIOs and Control Signals used on the STM32L476. This table relates the signals of the rhomb.io standard with the net names of the schematic and with the components to which they are connected.

Rhomb.io Signal Schematic Signal Component Component Pin Comments
#NMI #NMI STM32L476 (1) PB1
#RESET_IN #RESET_IN STM32L476 (1) NRST
Debug Connector (J1) 10
1WIRE 1WIRE STM32L476 (1) PB12
ID Memory (U2) IO
AD A0/AD0 STM32L476 (1) PA0
A1/AD1 PA1
A2/AD2 PA4
A3/AD3 PB0
A4/AD4 PC1
A5/AD5 PC0
CAPT CAPT0 STM32L476 (1) PC3
CAPT1 PC2
COMP COMP-A_N STM32L476 (1) PC4
COMP-A_P PC5
CLK32K CLK32K STM32L476 (1) PC14-OSC32_IN R13 must be assembled
INT D3/INT0/JTAG_TDO STM32L476 (1) PB3
INT1 PB7
INT2/JTAG_TDI PA15
PWM D9/PWM0 STM32L476 (1) PC7
User LED (LED)
PWM1 STM32L476 (1) PE9
PWM2 PD14
PWM3 PC6
PWM4 PB2
RESET_OUT RESET_OUT STM32L476 (1) PE0
IO D4/IO0 STM32L476 (1) PB5
D5/IO1/JTAG_TRST PB4
D6/IO2 PB10
D7/IO3 PA8
D8/IO4 PA9
IO5 PE8
IO6 PE7
IO7 PB15
IO8 PC13
IO9 PD7
IO10 PD10
IO11 PD11
IO12 PD12
IO13 PB13
IO14 PC3
IO15 PC2
  • CAPT: Input Capture share lines with “IO14” and “IO15”
  • CLK32K: This line is connected to the oscilator input of the microcontroller. To avoid interferences with the onboard oscilator, you can disassemble a 0R0 resistor (R13)
  • JTAG: “INT2”, “INT0” and “IO1” signals share line with “JTAG_TDI”, “JTAG_TDO” and “JTAG_TRST” signals.

POWER

The STM32L476 can use the 1.8 V, the 2.8 V rail or the 3.3 V rail. You can choose the voltage shorting the corresponding solder-jumper. Make sure this rail is enabled on the motherboard you are going to plug this module.

The power consumption varies with different power modes and work statuses of functional modules. Find more information in STM32L476 datasheet.

MECHANICAL SPECIFICATIONS

 

S200 Master - STM32L476 Dimensions.png

WARRANTY

Precaution against Electrostatic Discharge. When handling rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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